Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2022

IEC ICC JEDEC ISPE MMPDS EEMUA
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2022
Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Handbook / Manual / Guide by Association Connecting Electronics Industries, 04/01/2022
Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 07/01/2022
General Electronic Components Model Based Definition (MBD) Standard
standard by Association Connecting Electronics Industries, 07/01/2022
Troubleshooting for Printed Board Fabrication Processes
standard by Association Connecting Electronics Industries, 02/01/2022
Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2021
Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
standard by Association Connecting Electronics Industries, 08/01/2021
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 02/01/2022
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 11/01/2021
Requirements for Soldering Fluxes
standard by Association Connecting Electronics Industries, 01/01/2022