Semiconductor Design Standard for Flip Chip Applications
standard by Association Connecting Electronics Industries, 04/01/1999
Category: IPC
IPC 9708
Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010
IPC 2615
Printed Board Dimensions and Tolerances
standard by Association Connecting Electronics Industries, 07/01/2000
IPC 2614
Sectional Requirements for Board Fabrication Documentation
standard by Association Connecting Electronics Industries, 03/01/2010
IPC TMRC-00T
2000 Technology Trends for Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 01/01/2000
IPC 7351A
Generic Requirements for Surface Mount Land Pattern and Design Standard – INCLUDES LAND PATTERN VIEWER SOFTWARE
standard by Association Connecting Electronics Industries, 02/01/2007
IPC TA-720
Technology Assessment Handbook on Laminates
standard by Association Connecting Electronics Industries,
IPC J-STD-003C-WAM1&2
Solderability Tests for Printed Boards with Amendment 1&2
standard by Association Connecting Electronics Industries, 09/01/2017
IPC 0040
Optoelectronics Assembly and Packaging Technology
standard by Association Connecting Electronics Industries, 05/01/2003
IPC A-620B
Requirements and Acceptance for Cable and Wire Harness Assemblies with Amendment 1
standard by Association Connecting Electronics Industries, 10/01/2012