General Specification for Encapsulated Discrete Wire Interconnection Boards
standard by Association Connecting Electronics Industries, 01/01/1995
Category: IPC
IPC 9631
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010
IPC J-STD-004B
Requirements for Soldering Fluxes – includes Amendment 1
standard by Association Connecting Electronics Industries, 12/01/2008
IPC FLEX-CO-99
IPC National Conference Flexible Circuits Volume I & II – Denver, CO 1999
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC ENVIRONMENT
Environmental Best Practices Guide
standard by Association Connecting Electronics Industries,
The 1999 Market for Electronics Manufacturing Services Providers/Contract Assembly Companies
Book by Association Connecting Electronics Industries, 04/07/2000
IPC M-104
Standards for Printed Board Assembly Manual
standard by Association Connecting Electronics Industries,
IPC A-610GC-Telecom(D)1
Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2019
IPC 7094
Design and Assembly Process Implementation for Flip Chip and Die Size Components
standard by Association Connecting Electronics Industries, 02/01/2009
IPC CI-408
Solderless Surface Mount Connectors Design Characteristics and Application Guidelines
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1994