Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 10/01/2013

IEC ICC JEDEC ISPE MMPDS EEMUA
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 10/01/2013
Bare Board Electrical Test – VIDEO
standard by Association Connecting Electronics Industries, 04/01/1998
Fine Line Round Robin Test Pattern
standard by Association Connecting Electronics Industries, 09/01/1984
Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/1998
Design Standard for Thick Film Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 12/01/1989
Printed Wiring Board Strain Gage Test Guideline
standard by Association Connecting Electronics Industries, 06/01/2005
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2018
Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 03/01/2018
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996
Cleaning and Cleanliness Test Program Phase 1 Test Results
standard by Association Connecting Electronics Industries, 10/01/1989