Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 01/01/2017
Category: IPC
IPC 4562A-WAM1
Metal Foil for Printed Board Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2016
IPC J-STD-001D
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005
IPC 7095B
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 03/01/2008
IPC J-STD-003C
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2013
IPC 2225
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998
IPC 7092
Design and Assembly Process Implementation for Embedded Components
standard by Association Connecting Electronics Industries, 02/01/2015
IPC J-STD-001FS
Space Applications Electronic Hardware Addendum to J-STD-001F
Amendment by Association Connecting Electronics Industries, 2015
IPC 1791A
Trusted Electronic Designer, Fabricator and Assembler Requirements
standard by Association Connecting Electronics Industries, 01/01/2020
IPC T-50M
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 05/01/2015