Design and Assembly Process Implementation for Flip Chip and Die-Size Components
standard by Association Connecting Electronics Industries, 01/01/2018

IEC ICC JEDEC ISPE MMPDS EEMUA
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
standard by Association Connecting Electronics Industries, 01/01/2018
National Conference on Bare Board and Advanced Substrate Electrical Test: HDI's Holy Grail Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
Statistical Process Control (SPC) Quality Rating
standard by Association Connecting Electronics Industries, 09/01/2002
Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage
standard by Association Connecting Electronics Industries, 10/01/1987
Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/09/2020
Printed Board Description in Digital Form
standard by Association Connecting Electronics Industries, 07/01/1992
Qualification and Performance Specification for Flexible Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2005
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2016
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017