Category: IPC

Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 01/01/2002

The Effect of Steam Aging Time and Temperature on Solderability Test Results
standard by Association Connecting Electronics Industries, 01/01/1993

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014

Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006

Chip Scale and BGA National Symposium Proceedings 1999
Conference Proceeding by Association Connecting Electronics Industries, 05/01/1999

Design Standard for Printed Electronics on Flexible Substrates
standard by Association Connecting Electronics Industries, 03/01/2018

Ten-Layer Multi Artwork – D-350 Format
standard by Association Connecting Electronics Industries,

Library Format Description for Printed Boards in Digital Form
standard by Association Connecting Electronics Industries, 02/01/1987

Requirements and Acceptance for Cable and Wire Harness Assemblies
standard by Association Connecting Electronics Industries, 01/01/2017

TMRC 1999 Market for Flexible Circuits – TMRC99F
Report / Survey by Association Connecting Electronics Industries, 01/01/1999