Qualifications and Performance of Polymer Thick Film Printed Boards
standard by Association Connecting Electronics Industries, 01/01/1987
Category: IPC
IPC T-50K
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 06/01/2013
IPC A-43-G
Ten-Layer Multi Artwork – Gerber Format
standard by Association Connecting Electronics Industries,
IPC 4101
Specifications for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 12/10/1997
IPC 4204
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
IPC M-102
Flexible Circuits Compendium
standard by Association Connecting Electronics Industries,
IPC LDFR0603
IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
IPC 7091
Design and Assembly Process Implementation of 3D Components
standard by Association Connecting Electronics Industries, 06/01/2017
IPC 6018A
Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 01/01/2002
IPC TR-465-2
The Effect of Steam Aging Time and Temperature on Solderability Test Results
standard by Association Connecting Electronics Industries, 01/01/1993