Small Hole Reliability Round Robin Artwork
standard by Association Connecting Electronics Industries, 09/01/1988

IEC ICC JEDEC ISPE MMPDS EEMUA
Small Hole Reliability Round Robin Artwork
standard by Association Connecting Electronics Industries, 09/01/1988
Reflow Oven Process Control Standard
standard by Association Connecting Electronics Industries, 03/01/2015
Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 03/01/2019
Sectional Design Standard for Flexible Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2011
Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999
Handbook on Adhesive Bonding in Electronic Assembly Operations
standard by Association Connecting Electronics Industries, 11/01/2015
Surface Mount Land Pattern Round Robin Artwork
standard by Association Connecting Electronics Industries,
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 01/01/2013
Flexible Circuits Compendium
standard by Association Connecting Electronics Industries,
IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003