Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/1995
Category: IPC
IPC J-STD-030
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
standard by Association Connecting Electronics Industries, 09/01/2005
IPC SM-784
Guidelines for Chip-on-Board Technology Implementation
standard by Association Connecting Electronics Industries, 11/01/1990
IPC A-610F
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014
IPC 6801
Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
standard by Association Connecting Electronics Industries, 01/01/2000
IPC 9201
Surface Insulation Resistance Handbook
standard by Association Connecting Electronics Industries, 04/01/1990
IPC 4101D
Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2014
IPC TMRC-00M
2000 Market For Electronics Manufacturing Services Providers/Contract Assembly
Report / Survey by Association Connecting Electronics Industries, 01/01/2000
IPC TR-486
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
standard by Association Connecting Electronics Industries, 07/01/2001
IPC 4553A
Specification for Immersion Silver Plating for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2009