Teleweb application – Part 3: Superteletext profile
standard by International Electrotechnical Commission, 05/18/2005

IEC ICC JEDEC ISPE MMPDS EEMUA
Teleweb application – Part 3: Superteletext profile
standard by International Electrotechnical Commission, 05/18/2005
Video surveillance systems for use in security applications – Part 2-3: Video transmission protocols – IP interoperability implementation based on Web services
standard by International Electrotechnical Commission, 11/07/2013
Alarm systems – Intrusion and hold-up systems – Part 2-2: Intrusion detectors – Passive infrared detectors
standard by International Electrotechnical Commission, 10/07/2010
Sample preparation for measurement of mercury level in fluorescent lamps CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 10/18/2017
Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems – Part 2: Modular multilevel converters CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 08/23/2019
Mechanical structures for electrical and electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series – Part 5: Cooling performance evaluation for indoor cabinets
standard by International Electrotechnical Commission, 04/20/2016
Industrial communication networks – High availability automation networks – Part 2: Media Redundancy Protocol (MRP)
standard by International Electrotechnical Commission, 02/26/2010
Concentric lay stranded overhead electrical conductors containing one or more gap(s)
standard by International Electrotechnical Commission, 04/25/2008
Electrical resistance trace heating systems for industrial and commercial applications – Part 2: Application guide for system design, installation and maintenance
standard by International Electrotechnical Commission, 09/09/2013
High-voltage switchgear and controlgear – Part 207: Seismic qualification for gas-insulated switchgear assemblies for rated voltages above 52 kV
standard by International Electrotechnical Commission, 04/27/2012