Heat-shrinkable moulded shapes – Part 2: Methods of test
standard by International Electrotechnical Commission, 07/10/2006

IEC ICC JEDEC ISPE MMPDS EEMUA
Heat-shrinkable moulded shapes – Part 2: Methods of test
standard by International Electrotechnical Commission, 07/10/2006
Instrument transformers – Part 15: Additional requirements for voltage transformers for DC applications
standard by International Electrotechnical Commission, 07/17/2018
Semiconductor devices – Semiconductor interface for human body communication – Part 2: Characterization of interfacing performances
standard by International Electrotechnical Commission, 02/18/2016
Spare parts provisioning
standard by International Electrotechnical Commission, 01/20/2017
Field device tool (FDT) interface specification – Part 306: Communication profile integration – IEC 61784 CPF 6
standard by International Electrotechnical Commission, 06/30/2009
Fixed electric double-layer capacitors for use in electronic equipment – Part 2: Sectional specfication – Electric double layer capacitors for power application
standard by International Electrotechnical Commission, 04/10/2006
Superconductivity – Residual resistance ratio measurement – Residual resistance ratio of Nb-Ti and Nb<sub>3</sub>Sn composite superconductors
standard by International Electrotechnical Commission, 01/19/2016
Bi-directional grid connected power converters – Part 1: General requirements
standard by International Electrotechnical Commission, 05/19/2017
Railway applications – Electromagnetic compatibility – Part 3-1: Rolling stock – Train and complete vehicle
standard by International Electrotechnical Commission, 02/15/2018
Adjustable speed electrical power drive systems – Part 7-202: Generic interface and use of profiles for power drive systems – Profile type 2 specification
standard by International Electrotechnical Commission, 11/27/2007