Category: IEC

Functional safety – Safety instrumented systems for the process industry sector – Part 2: Guidelines for the application of IEC 61511-1
standard by International Electrotechnical Commission, 07/01/2003

Printed board assemblies – Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
standard by International Electrotechnical Commission, 01/14/2010

Industrial communication networks – Fieldbus specifications – Part 6-19: Application layer protocol specification – Type 19 elements
standard by International Electrotechnical Commission, 08/19/2014

Methods of measurement on receiving antennas for satellite broadcast transmissions in the 11/12 GHz band – Part 2: Mechanical and environmental tests on individual and collective receiving antennas
standard by International Electrotechnical Commission, 02/14/1996

Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape – Format D-7 – Part 1: VTR specifications
standard by International Electrotechnical Commission, 10/27/2005

Quality of Electronic and Software Intellectual Property Used in System and System on Chip (SoC) Designs
standard by International Electrotechnical Commission, 03/11/2015

Functional safety of electrical/electronic/programmable electronic safety-related systems – Part 1: General requirements (see
standard by International Electrotechnical Commission, 04/30/2010

Printed board assemblies – Part 4: Sectional specification – Requirements for terminal soldered assemblies
standard by International Electrotechnical Commission, 07/26/2017

Industrial communication networks – Fieldbus specifications – Part 6-19: Application layer protocol specification – Type 19 elements
standard by International Electrotechnical Commission, 08/06/2010

LED modules for general lighting – Safety specifications CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 10/30/2012