IEC 61784-5-4 Ed. 1.1 b:2015

Industrial communication networks – Profiles – Part 5-4: Installation of fieldbuses – Installation profiles for CPF 4 CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 06/16/2015

IEC 61606-1 Ed. 1.0 en:2003

Audio and audiovisual equipment – Digital audio parts – Basic measurement methods of audio characteristics – Part 1: General
standard by International Electrotechnical Commission, 10/10/2003

IEC 61355-1 Ed. 2.0 b:2008

Classification and designation of documents for plants, systems and equipment – Part 1: Rules and classification tables
standard by International Electrotechnical Commission, 04/10/2008

IEC 61097-4 Ed. 2.0 en:2007

Global maritime distress and safety system (GMDSS) – Part 4: INMARSAT-C ship earth station and INMARSAT enhanced group call (EGC) equipment – Operational and performance requirements, methods of testing and required test results
standard by International Electrotechnical Commission, 10/09/2007

IEC 61726 Ed. 2.0 b:1999

Cable assemblies, cables, connectors and passive microwave components – Screening attenuation measurement by the reverberation chamber method
standard by International Electrotechnical Commission, 11/30/1999

IEC 61158-5-8 Ed. 1.0 en:2007

Industrial communication networks – Fieldbus specifications – Part 5-8: Application layer service definition – Type 8 elements
standard by International Electrotechnical Commission, 12/14/2007

IEC 62137-1-3 Ed. 1.0 b:2008

Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test
standard by International Electrotechnical Commission, 11/27/2008

IEC 61837-3 Ed. 1.0 b:2000

Surface mounted piezoelectric devices for frequency control and selection – Standard outlines and terminal lead connections – Part 3: Metal enclosures
standard by International Electrotechnical Commission, 08/30/2000

IEC 61772 Ed. 2.0 b:2009

Nuclear power plants – Control rooms – Application of visual display units (VDUs)
standard by International Electrotechnical Commission, 04/29/2009