High-voltage fuses – Part 1: Current-limiting fuses CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/22/2014

IEC ICC JEDEC ISPE MMPDS EEMUA
High-voltage fuses – Part 1: Current-limiting fuses CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/22/2014
Semiconductor devices – Part 14-1: Semiconductor sensors – Generic specification for sensors
standard by International Electrotechnical Commission, 01/21/2010
Amendment 1 – Plugs, socket-outlets and couplers for industrial purposes – Part 1: General requirements
Amendment by International Electrotechnical Commission, 10/21/2005
Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
standard by International Electrotechnical Commission, 11/26/2009
Safety of laser products – Part 1: Equipment classification and requirements
standard by International Electrotechnical Commission, 05/15/2014
Specification for solventless polymerisable resinous compounds used for electrical insulation – Part 2-2: Methods of test – Test methods for coating powders for electrical purposes
standard by International Electrotechnical Commission, 01/01/1984
Household and similar electrical appliances – Safety – Part 2-27: Particular requirements for appliances for skin exposure to optical radiation
standard by International Electrotechnical Commission, 05/17/2019
Lead-acid starter batteries – Part 1: General requirements and methods of test
standard by International Electrotechnical Commission, 11/28/2006
Semiconductor devices – Part 18-1: Semiconductor bio sensors – Test method and data analysis for calibration of lens-free CMOS photonic array sensors
standard by International Electrotechnical Commission, 05/20/2019
Connectors for electronic equipment – Part 7-3: Detail specification for 8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to 100 MHz
standard by International Electrotechnical Commission, 01/30/2008