High-voltage switchgear and controlgear – ALL PARTS
standard by International Electrotechnical Commission, 01/06/2020

IEC ICC JEDEC ISPE MMPDS EEMUA
High-voltage switchgear and controlgear – ALL PARTS
standard by International Electrotechnical Commission, 01/06/2020
Mechanical standardization of semiconductor devices – Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
standard by International Electrotechnical Commission, 04/23/1997
Metallic communication cable test methods – Part 4 – 9: Electromagnetic compatibility (EMC) – Coupling attenuation of screened balanced cables, triaxial method CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 07/06/2020
Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 10/22/2002
Amendment 1 – Communication networks and systems for power utility automation – Part 7-2: Basic information and communication structure – Abstract communication service interface (ACSI)
Amendment by International Electrotechnical Commission, 02/10/2020
Railway applications – Electric equipment for rolling stock – Rules for power resistors of open construction
standard by International Electrotechnical Commission, 03/15/2001
Packaging of components for automatic handling – Part 3: Packaging of surface mount components on continuous tapes
standard by International Electrotechnical Commission, 05/17/2013
Graphite electrodes for electric arc furnaces – Dimensions and designation
standard by International Electrotechnical Commission, 06/22/2005
Electroacoustics – Hearing aids – Part 7: Measurement of the performance characteristics of hearing aids for production, supply and delivery quality assurance purposes
standard by International Electrotechnical Commission, 10/21/2005
Glow-starters for fluorescent lamps
standard by International Electrotechnical Commission, 11/30/1993