User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010

IEC ICC JEDEC ISPE MMPDS EEMUA
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010
User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016
Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
standard by Association Connecting Electronics Industries, 07/01/2017
General Specification for Encapsulated Discrete Wire Interconnection Boards
standard by Association Connecting Electronics Industries, 01/01/1995
IPC International Conference on Embedded Passives "The Faster and Cleaner Electronic Signals for the Future" – Northbrook, IL – June 2003
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
standard by Association Connecting Electronics Industries, 07/01/2012
Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2019
American National Standard for Electric Connectors-Sealed Insulated Underground Connector Systems Rated 600 Volts
standard by American National Standards Institute, 03/14/2011
American National Standard for Electricity Meters – 0.1, 0.2, and 0.5 Accuracy Classes
standard by American National Standards Institute, 04/01/2017
American National Standard for Electric Lamps- Tubular Tungsten-Halogen Lamps, Physical Characteristics
standard by American National Standards Institute, 02/15/2018