Sampling procedures for inspection by attributes — Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection (FOREIGN STANDARD)
standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/2006

IEC ICC JEDEC ISPE MMPDS EEMUA
Sampling procedures for inspection by attributes — Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection (FOREIGN STANDARD)
standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/2006
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998
Design and Assembly Process Implementation for Embedded Components
standard by Association Connecting Electronics Industries, 02/01/2015
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 03/01/2008
Space Applications Electronic Hardware Addendum to J-STD-001F
Amendment by Association Connecting Electronics Industries, 2015
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2013
standard by Heat Exchange Institute, 2016
Passenger Ropeways – Aerial Tramways, Aerial Lifts, Surface Lifts, Tows and Conveyors – Safety Requirements
standard by American National Standards Institute, 01/01/2006
ANSI/NEMA High Intensity Discharge (HID) Set
standard by American National Standards Institute,
Glossary of terms used in medical electrical equipment (general terms) (FOREIGN STANDARD)
standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/1988