Methods for determining distribution temperature and colour temperature or correlated colour temperature of light sources (Foreign Standard)
standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/2015

IEC ICC JEDEC ISPE MMPDS EEMUA
Methods for determining distribution temperature and colour temperature or correlated colour temperature of light sources (Foreign Standard)
standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/2015
Single sampling inspection plans having desired operation characteristics by variables (standard deviation known) (FOREIGN STANDARD)
standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/1979
Sectional Standard on Rigid PWB Design
standard by Association Connecting Electronics Industries, 03/01/1998
Specifications for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 12/10/1997
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
Ten-Layer Multi Artwork – Gerber Format
standard by Association Connecting Electronics Industries,
IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
Flexible Circuits Compendium
standard by Association Connecting Electronics Industries,
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 06/01/2013
Qualifications and Performance of Polymer Thick Film Printed Boards
standard by Association Connecting Electronics Industries, 01/01/1987